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| BCR Vishay Electro-Films Thin Film, Back-Contact Resistor CHIP RESISTORS FEATURES * Wire bondable Product may not be to scale * Only one wire bond required * Small size: 0.020 inches square. * Resistance range: 10 to 1 M * Oxidized silicon substrate for good power dissipation The Back Contact Resistor (BCR) series single-value back-contact resistor chip is one of the smallest chips available. The BCR requires only one wire bond thus saving hybrid space. The BCRs are manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment and manufacturing technology. The BCRs are 100 % electrically tested and visually inspected to MIL-STD-883. * Resistor material: Tantalum nitride, self-passivating * Moisture resistant APPLICATIONS Vishay EFI BCR resistor chips are widely used in hybrid packages where space is limited. The bottom connection is made by attaching the back of the chip to the substrate either eutectically or with conductive epoxy. The single wire bond is made to the notched pad on the top of the chip. (The other rectangular pad on the top of the chip is a via hole, a low-ohmic contact connecting the resistor to the bottom of the chip.) TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES Tightest Standard Tolerance Available 5% 2% 1% 0.5 % 0.2 % 0.1 % PROCESS CODE CLASS H* CLASS K* 056 061 059 052 010 002 027 008 *MIL-PRF-38534 inspection criteria 25 ppm/C 50 ppm/C 100 ppm/C 250 ppm/C 360 k 1 M 200 k 620 k 10 20 50 100 200 1 k STANDARD ELECTRICAL SPECIFICATIONS PARAMETER Noise, MIL-STD-202, Method 308 100 - 250 k < 100 or > 251 k Moisture resistance, MIL-STD-202 Method 106 Stability, 1000 h, + 125 C, 125 mW Operating Temperature Range Thermal Shock, MIL-STD-202, Method 107, Test Condition F High Temperature Exposure, + 150 C, 100 h Dielectric Voltage Breakdown Insulation Resistance Operating Voltage DC Power Rating at + 70 C (Derated to Zero at + 175 C) 5 x Rated Power Short-Time Overload, + 25 C, 5 s www.vishay.com 54 For technical questions, contact: efi@vishay.com - 35 dB typ. - 20 dB typ. 0.5 % max. R/R 1.0 % max. R/R - 55 C to + 125 C 0.25 % max. R/R 0.5 % max. R/R 200 V 1012 min. 75 V max. 250 mW 0.25 % max. R/R Document Number: 61023 Revision: 12-Mar-08 BCR Thin Film, Back-Contact Resistor Vishay Electro-Films DIMENSIONS in inches 0.020 CHIP RESISTORS 0.016 0.020 0.004 TYPICAL RANGE 10 - 23 TYPICAL RANGE 24 - 220 TYPICAL RANGE 180 - 2.2 k TYPICAL RANGE 1.6 k - 1 M Note: * Notched shaded area represents top bonding pad. The backside of the chip constitutes the second resistor connection. SCHEMATIC Bond Pad Back of Chip MECHANICAL SPECIFICATIONS in inches PARAMETER Chip Size Chip Thickness Chip Substrate Material Resistor Material Bonding Pad Size Number of Pads Pad Material Backing Recommended Attachment Method Options: Gold bonding pads, 15 kA minimum thickness Consult Applications Engineer 0.020 x 0.020 0.002 (0.50 x 0.50 0.05 mm) 0.010 0.003 (0.253 0.05 mm) Oxidized silicon, 10 kA minimum SiO2 Tantalum nitride, self-passivating 0.004 x 0.004 (0.100 x 0.100 mm) 1 10 kA minimum aluminum 3 kA minimum gold Eutectic or conductive epoxy ORDERING INFORMATION Example: 100 % visual, 16 k, 1 %, 250 ppm/C TCR, aluminum pads, class H visual inspection W INSPECTION/ PACKAGING W = 100 % visually inspected parts in matrix tray per MIL-STD-883 X = Sample, visually inspected parts loaded in matrix trays (4 % AQL) BCR PRODUCT FAMILY 008 PROCESS CODE See Process Code table 1600 RESISTANCE VALUE Use first 4 digits significant digits of the resistance 1 MULTIPLIER CODE B = 0.01 A = 0.1 0=1 1 = 10 2 = 100 3 = 1000 F TOLERANCE CODE B = 0.1 % C = 0.2 % D = 0.5 % F = 1.0 % G = 2.0 % H = 2.5 % J = 5.0 % K = 10 % Document Number: 61023 Revision: 12-Mar-08 For technical questions, contact: efi@vishay.com www.vishay.com 55 Legal Disclaimer Notice Vishay Disclaimer All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, "Vishay"), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners. Document Number: 91000 Revision: 18-Jul-08 www.vishay.com 1 |
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